Silicon wafer cutting machine
Silicon wafer cutting machine
Equipment model: GPV-HP-WSG08
Equipment introduction: This device can achieve non-destructive cutting of single crystal silicon wafers, with strong compatibility, high efficiency, good cutting quality, and stability and reliability.
Equipment advantages and characteristics:
1. Flexible loading and unloading methods, supporting flower baskets or material boxes.
2. The main frame is a welded steel structure, sturdy and reliable, ensuring smooth operation.
3. Specially designed scratch free suction cups.
4. Dual track independent control.
5. The program can store multiple sets of formulas and quickly switch between different products.
6. The program can set multiple operation permissions with password protection.
7. Autonomous AI algorithm for PL and infrared crack detection.
8. Support MES docking.
Technical parameters:
| Serial Number | Equipment specifications | Standard value |
|---|---|---|
| 1 | Equipment model | GPV-HP-WSG08 |
| 2 | capacity | 6500PCS/H |
| 3 | Comprehensive Fragment Rate | ≤0.2% |
| 4 | Applicable types of silicon wafers | Monocrystalline silicon wafer |
| 5 | Applicable dimensions of silicon wafers | G12, tolerance ± 0.25mm |
| 6 | wafer thickness | 100-130um，±10um |
| 7 | Slice specifications | Standard 1/2 piece |
| 8 | Straightness | ±0.075mm |
| 9 | Large and small pieces | ±0.075mm |
| 10 | Slicing method | Laser non-destructive cutting with water |
| 11 | Head and tail slot length | ≤1.5mm±0.2mm |
| 12 | Width of head and tail slots | ≤100μm±10μm |
| 13 | Depth of head and tail grooves | ≤ 40% of thickness (adjustable) |
| 14 | Heat affected area | None (excluding head and tail slots) |
| 15 | Scratch control | No scratches, damages, or contamination caused by the transmission process |
| 16 | Detection module | PL (mandatory), infrared cracking (mandatory), large and small chips (mandatory), resistivity/thickness (optional), minority carrier (optional) |
| 17 | MES interface | Yes, it supports device data output to the central control host |
| 18 | Operating ambient temperature | 25℃±10℃ |
| 19 | Compressed air | 0.5MPa－0.8MPa |
| 20 | Power supply | AC 380V 50/60Hz three-phase five wire system |
| 21 | power consumption | Peak: 55KW, average: 33KW |
| 22 | Equipment weight | 10000KG |
| 23 | Equipment size | 12900mm×2485mm×2275mm |